8-12 inch monitor wafers (flatness wafers and others) at low prices
Chinese, Korean, and Japanese wafers can all be provided.
Since its establishment in 1994, MCO Corporation has been engaged in silicon wafer fabrication and sales, thin film deposition processing of various silicon and metallic quartz, quartz processing, and IC foundry sales.
We will respond to your needs with speed and reliability. We are currently strengthening our supply to the United States.
| Item | Specification |
|---|---|
| Poly type | 4H |
| Surface orientation | 4°toward<11-20>±0.5° |
| Dopant | N type Nitrogen |
| Specific resistance (RT) | 0.015-0.025Ω·cm |
| Micro pipe | ≤2ea/cm2 |
| TSD | ≤500ea/cm2 |
| BPD | ≤2,000ea/cm2 |
| Item | Specification |
|---|---|
| Poly type | 4H |
| Surface orientation | 4°toward<11-20>±0.5° |
| Dopant | N type Nitrogen |
| Specific resistance (RT) | N/A |
| Micro pipe | ≤2ea/cm2 |
| TSD | N/A |
| BPD | N/A |
| Item | Specification |
|---|---|
| Poly type | 4H |
| Surface orientation | 4°toward <11-20>±0.5° |
| Specific resistance (RT) | 0.015-0.028Ω·cm |
| Micro-pipe density | ≤1ea/cm2 |
| EPD | ≤8,000ea/cm2 |
| TED | ≤6,000ea/cm2 |
| BTSD | ≤1,000ea/cm2 |
| Item | Specification |
|---|---|
| Poly type | 4H |
| Surface orientation | 4°toward<11-20>±0.5° |
| Specific resistance (RT) | 0.014-0.028Ω·cm |
| Micro-pipe density | ≤5ea/cm2 |
| EPD | N/A |
| TED | N/A |
| BTSD | N/A |
Silicon wafers are used for equipment conditioning, dicer and BG pre-cut, and transfer testing. We can handle not only monitor wafers, but also various sizes, thicknesses, and particle wafers. P type/N type, orifler/V notch, crystal orientation, etc. are available upon request. We also accept small-lot orders for various types of film wafers, so please contact us for more information. We also sell small-diameter 2-inch to 6-inch monitor wafers at low prices. We also sell 8“ to 12” monitor wafers at low prices. We accept orders from small lots. Please check the following standard list for products. We can also order products not listed in the standards table, so please contact us for more information. For inquiries and quotations for this product, please use the Inquiry/Quotation Form.
| 76mm | 100mm | 125mm | 150mm | 200mm | 300mm | 450mm(*) | |
|---|---|---|---|---|---|---|---|
| Diameter tolerance (mm) | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 |
| Wafer thickness (μm) | 380 | 525 | 625 | 625 | 725 | 775 | 925 |
| Thickness Tolerance (µm) | ±25 | ±25 | ±25 | ±25 | ±25 | ±25 | ±25 |
| Flat | {110}±1° | {110}±1° | {110}±1° | {110}±1° | {110}±1° | {110}±1° | {110}±1° |
| Flat length (mm) | 22 | 32.5 | 42.5 | 47.5 | 57.5 | ||
| Shape | OF | OF | OF | OF | OF Notch |
Notch | Notch |
| Flat Length Tolerance (mm) | ±1.5 | ±2.5 | ±2.5 | ±2.5 | ±2.5 | ||
| Orientation of notch axis | – | – | – | – | <110>±1° | <110>±1° | <110>±1° |
| Notch depth (mm) | – | – | – | – | 1 | 1 | 1 |
| Notch depth tolerance (mm) | – | – | – | – | +0.25,-0.00 | +0.25,-0.00 | +0.25,-0.00 |
| Notch angle (°) | – | – | – | – | 90 | 90 | 90 |
| Notch angle tolerance (°) | – | – | – | – | +5,-1 | +5,-1 | +5,-1 |
*Single Carrier or FOSB
A silicon wafer is one of the materials used to make electronic components called integrated circuits (IC or LSI), and is made of high-purity silicon (silicon).
A wafer is made by slicing a cylindrical object called an ingot, which is made of crystals of semiconductor materials such as silicon, into a thin plate about 1 mm thick, and then polishing and cleaning the surface.
Most of the wafers used in modern integrated circuits are silicon wafers, which have been applied to the manufacture of various electronic circuits, including the introduction of impurities such as acceptors and donors to form semiconductor elements, thereby contributing greatly to modern life.
In fact, Japan is by far the world leader in the production of silicon wafers, and by 2021, production by two companies alone, Shin-Etsu Chemical and SUMCO Corporation, will account for about half of the global market share.
Japan's silicon wafer manufacturing technology is so advanced and precise that even the smallest invisible surface irregularities are thoroughly eliminated and processed smoothly, making it flatter than any other material in the world.
Although we rarely see silicon wafers directly in our daily lives, they play an important role in places where we cannot see them.
For example, silicon wafers are used not only in electronic devices such as smartphones and PCs, but also in home appliances such as TVs and air conditioners, as well as in automobiles and public transportation.
Device Performance
Stable operation under high temperature and high power density.
Lifetime
Excellent heat resistance and radiation resistance, making it resistant to environmental changes.
Reliability
Performance is maintained over long periods of use, reducing the incidence of defective products.
Competitiveness
Increased competitiveness in the market by gaining customer trust.
| Off Angle | Grade | Number of Micro | Vibes | Thickness Surface Finish |
|---|---|---|---|---|
| 4°±0.5° | Production Research Dummy |
≦1cm-2 ≦30cm-2 ≦50cm-2 |
350±25um | Si surface: CMP finish C-face: Optical mirror finish (mirror) |
| Vibes | Thickness Surface Finish |
|---|---|
| 350±25um | Si surface: CMP finish C-face: Optical mirror finish (mirror) |
| Off Angle | Grade | Number of Micro | Vibes | Thickness Surface Finish |
|---|---|---|---|---|
| 4°±0.5° 0°±0.5° |
Production Research Dummy |
≦1cm-2 ≦30cm-2 ≦50cm-2 |
350±25um | Si surface: CMP finish C-face: Optical mirror finish (mirror) |
| Vibes | Thickness Surface Finish |
|---|---|
| 350±25um | Si surface: CMP finish C-face: Optical mirror finish (mirror) |
| Off Angle | Grade | Number of Micro | Vibes | Thickness Surface Finish |
|---|---|---|---|---|
| 0°±0.5° | Production Research Dummy |
≦1cm-2 ≦30cm-2 ≦50cm-2 |
350±25um | Si surface: CMP finish C-face: Optical mirror finish (mirror) |
| Vibes | Thickness Surface Finish |
|---|---|
| 350±25um | Si surface: CMP finish C-face: Optical mirror finish (mirror) |
SiC wafers have a band cap width about 3 times wider and thermal conductivity about 3 times higher than silicon.
SiC wafers are used as substrates for RF amplifiers and light-emitting diodes (LEDs), as well as for various power semiconductors.
Dramatically expanded range of applications
We have secured a large number of procurement channels
We can offer a wide variety of products.
We are always mindful of speedy delivery.
Demand for 8-inch SiC wafers is rapidly increasing for automotive applications, inverters, and other power device MCO Corporation handles 2, 3, 4, 6, and 8-inch SiC wafers and currently provides a stable supply of 8-inch SiC wafers.
About SiC Wafer
SiC wafer is a type of wafer that is used to make electronic components. SiC stands for silicon carbide, a compound of silicon and carbon. SiC wafers, created to manufacture more advanced semiconductor devices, have far superior characteristics to conventional silicon wafers.
For example, the dielectric breakdown electric field strength is about 10 times greater than that of silicon wafers, making them less susceptible to breakage even when subjected to such high electric fields. In addition, the “band gap,” in which electrons cannot exist, is about three times larger than that of silicon wafers, helping to make devices more resistant to heat.
When circuits become hot, electrons can cross the band gap by thermal energy, but it takes a lot of thermal energy to cross a wide band gap, which has the advantage of increasing the upper operating temperature limit of devices.
In addition, SiC has a higher thermal conductivity than silicon, making it excellent at dissipating heat, which also helps in the manufacture of devices that are resistant to high temperatures.
With such high potential, SiC wafers are used in power semiconductors, which are indispensable as key circuits in recent advanced electronic devices, and in high-brightness LEDs. However, SiC is a hard and brittle material, so manufacturing SiC wafers requires extremely advanced technology and is time-consuming in processing.
Currently, processing technologies to improve productivity and reduce market prices are being actively researched and are expected to be introduced in the future.
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Since its establishment in 1994, M.C.O. Corporation has been engaged in the manufacture and sale of silicon wafers, various types of silicon and metallic quartz, etc.
thin film deposition, quartz processing, and sales of IC foundries. We will respond to your needs with speed and reliability.
